S-04 · THERMAL
Will it overheat? Temperatures and margins you can put in front of an approver.
Steady and transient thermal analysis of electronics, electrical equipment, enclosures and structures — every heat source traced to a datasheet, every boundary condition stated, and every temperature compared with the limit that matters.
- TYPICAL SCOPE
- Power electronics, electrical cabinets and switchgear, transformers, enclosures, heat sinks, structures
- DELIVERABLE
- Signed PDF report, temperature and margin tables, field plots; temperature fields for FEA on request
- LEAD TIME
- Agreed in the written scope
- ANALYSES
- Steady · transient · CHT with CFD · thermal–electric · thermal stress
- CONFIDENTIALITY
- NDA signed before any file is exchanged
- QUALITY
- Energy balance and hand check in every report
01 / WHEN YOU NEED IT
Questions this analysis answers.
Thermal problems cost twice: once in derated or failed components, and again in oversized cooling you pay for on every unit.
We start from the limit that matters — a junction temperature, an insulation class, a touch temperature — and build the model around the heat path that decides it.
02 / DELIVERABLES
What you receive. In writing, before we start.
Each item is listed in the scope document you sign off. Nothing on this list is a surprise at the end.
Technical report
Scope, heat loads, assumptions, model, results and conclusions. Signed and revision-controlled.
Temperature & margin tables
Temperature and margin to the limit for every critical component, per operating point.
Temperature field plots
Temperatures and heat paths on the surfaces and sections that explain the result.
Temperature fields for FEA
Mapped temperature fields for thermal-stress analysis.
Verification appendix
Mesh study, energy balance, resistance-network hand check, sensitivity to h and contact resistance.
Design recommendations
Where the heat gets stuck, and which change — material, contact, fin or airflow — lowers T_max.
Results review meeting
A walk-through with your engineers. Questions answered and recorded in the final revision.
Revision round
Re-run for design changes within the agreed scope, with a revision log in the report.
03 / METHODS
The right analysis for the question — not the most expensive one.
Conduction, convection and radiation are modelled as far as they change the answer — and the convection side comes either from correlations or from a coupled CFD model, stated in the report.
04 / PROCESS & TIMELINE
From problem statement to signed report.
Five steps, each with a clear hand-off. You always know what we need from you and what you get back.
-
012 day
Scoping call
FROM YOUProblem statement, drawings, limitsFROM USNDA, list of questions and missing data -
022 days
Scope & fixed quote
FROM YOUHeat losses, cooling data, operating pointsFROM USWritten scope, assumptions, acceptance criteria, price -
037 days
Model & solve
FROM YOUCAD, materials, interface dataFROM USInterim check-in: heat paths and first temperatures -
042 days
Verify & check
FROM YOUNothing — internal stepFROM USEnergy balance, hand check, sensitivity, second-engineer review -
052 days
Report & review
FROM YOUYour comments on the draftFROM USSigned report, files, review meeting
05 / INPUTS
What we need from you.
- [✓]Geometry — STEP / IGES / Parasolid, or dimensioned drawings
- [✓]Heat sources — losses per component at the operating points
- [✓]Material data — conductivity, heat capacity, emissivity; interface materials
- [✓]Cooling — fans, flow rates, heat sinks, ambient and solar conditions
- [✓]Temperature limits and acceptance criteria
- [✓]The decision the result feeds, and the deadline
- [+]Measured temperatures or thermal-camera images
- [+]Duty cycles and load profiles
- [+]Fan curves and datasheets
- [+]Previous calculations or test reports
- [+]Comments from your customer or approver
Heat sources come from datasheet losses at the governing operating point. Conduction paths, contact resistances and the cooling boundary are listed below; each value is referenced to the input register (Appendix B).
Start-up from T_a = [__] °C at full load for [__] min, then [duty cycle]. The time to reach the limit and the peak gradient are reported; the temperature field is mapped to the structural model for thermal stress.
06 / THE REPORT
See the report before you buy it.
A signed, revision-controlled report of 60 pages on average. Every temperature is traced to an operating point, a heat load from a named datasheet and a boundary condition with its source.
- T1Assumption registerEvery assumption — above all contact resistances and h values — numbered and justified.
- T2Heat-load traceabilityEach heat source names its operating point and the datasheet it comes from.
- T3Verification evidenceEnergy balance, resistance-network hand check and mesh study — included, not just claimed.
- T4Reproducible modelSolver, version, material data, boundary conditions and correlations are stated.
- T5Plain-language conclusionOne page a manager can read: within limits or not, the margin, and what to change.
07 / APPLICATIONS
Typical equipment and structures.
08 / STANDARDS
Checked to the clause your approver reads.
Temperature limits and verification methods come from the standard your equipment is designed or certified to — cited in the report.
09 / HOW TO ENGAGE
Three ways to work with us.
Prices are fixed per written scope. You pay for the answer to a defined question, not for open-ended hours.
Fixed-scope project
- BEST FOR
- A defined part or structure with a clear question
- PRICE
- Fixed quote after scoping
Engineering retainer
- BEST FOR
- Design teams with recurring analysis needs
- PRICE
- Quoted per scope
Third-party review
- BEST FOR
- Checking an FEA or hand calculation done by someone else
- PRICE
- Fixed quote
10 / FAQ
Asked before every project.
Something else? Ask it in the problem statement — the answer comes with the scope.
Which software do you use?
Tessera — the solver we build — runs the free calculators on this site today, each published with its reference cases. For project work the solver is chosen against the standard the result must satisfy, and named in the written scope. Every report states the solver, version, material data and how convection was modelled.
Do we need CFD, or is a thermal model enough?
If convection can be described by correlations — a wall, a fin, a known airflow — a thermal model is enough. If the airflow itself decides the result, we couple it with CFD (S-02).
Our component datasheet only gives losses at one point. Is that enough?
Often yes. We use the worst credible operating point and state it; if the answer is close to the limit, we ask for more data or run a sensitivity.
Can you use our thermocouple or thermal-camera data?
Yes — measured temperatures are used to calibrate contact resistances and h values, and the comparison is reported.
Can the temperatures feed a structural check?
Yes — the temperature field is mapped to the FE model for thermal stress. See S-01 Structural.
How is the price set?
Per written scope: number of components and operating points, and whether transient, CHT or thermal-stress analysis is needed.
11 / PROBLEM STATEMENT
Send the heat load. Get a written scope back.
Tell us what heats up, how it is cooled and which temperature it must stay below. We reply with questions or a fixed scope.
- [✓] NDA before data exchange
- [✓] Response within [X] business day(s)
- [✓] Scope, assumptions & acceptance criteria in writing