SPEC SHEET S-04 · REV A · UPDATED SEP 2026

S-04 · THERMAL

Will it overheat? Temperatures and margins you can put in front of an approver.

Steady and transient thermal analysis of electronics, electrical equipment, enclosures and structures — every heat source traced to a datasheet, every boundary condition stated, and every temperature compared with the limit that matters.

ρcₚ ∂T/∂t = ∇·(k∇T) + q̇T_max vs. T_limitmargin [K]
[✓] NDA before data exchange[✓] Fixed scope & price[✓] Independent internal check
FIG. 1 — Heat spreading from a source SCHEMATIC coldhot
S-04 · AT A GLANCESPEC
TYPICAL SCOPE
Power electronics, electrical cabinets and switchgear, transformers, enclosures, heat sinks, structures
DELIVERABLE
Signed PDF report, temperature and margin tables, field plots; temperature fields for FEA on request
LEAD TIME
Agreed in the written scope
ANALYSES
Steady · transient · CHT with CFD · thermal–electric · thermal stress
CONFIDENTIALITY
NDA signed before any file is exchanged
QUALITY
Energy balance and hand check in every report
Get a scoped quote →

01 / WHEN YOU NEED IT

Questions this analysis answers.

Thermal problems cost twice: once in derated or failed components, and again in oversized cooling you pay for on every unit.

We start from the limit that matters — a junction temperature, an insulation class, a touch temperature — and build the model around the heat path that decides it.

Q1Will every component stay below its temperature limit?→ Steady-state thermal + margins
Q2How long can it run at overload before it overheats?→ Transient thermal, duty cycles
Q3Is the heat sink or fan big enough — or too big?→ Cooling design & sizing
Q4Why is this part running hot in the field?→ Root cause with measured data
Q5Will temperature differences crack the joint?→ Thermal stress → S-01
Q6Is the surface safe to touch?→ Touch-temperature check

02 / DELIVERABLES

What you receive. In writing, before we start.

Each item is listed in the scope document you sign off. Nothing on this list is a surprise at the end.

PDF

Technical report

Scope, heat loads, assumptions, model, results and conclusions. Signed and revision-controlled.

XLSX · PDF

Temperature & margin tables

Temperature and margin to the limit for every critical component, per operating point.

IN REPORT

Temperature field plots

Temperatures and heat paths on the surfaces and sections that explain the result.

ON REQUEST

Temperature fields for FEA

Mapped temperature fields for thermal-stress analysis.

APPENDIX

Verification appendix

Mesh study, energy balance, resistance-network hand check, sensitivity to h and contact resistance.

IN REPORT

Design recommendations

Where the heat gets stuck, and which change — material, contact, fin or airflow — lowers T_max.

2 H ONLINE

Results review meeting

A walk-through with your engineers. Questions answered and recorded in the final revision.

Revision round

Re-run for design changes within the agreed scope, with a revision log in the report.

03 / METHODS

The right analysis for the question — not the most expensive one.

Conduction, convection and radiation are modelled as far as they change the answer — and the convection side comes either from correlations or from a coupled CFD model, stated in the report.

FIG. 0 — Heat front spreading from a source (schematic)
ANALYSISUSE IT WHENKEY OUTPUTTYPICAL REFERENCE
Steady-state conductionContinuous operation; convection known from correlationsTemperature field, heat flow paths, marginsCorrelations stated in report
Transient thermalStart-up, overload, duty cycles, thermal inertiaTemperature history, time to limit, time constantTime-step study included
Conjugate heat transferConvection drives the answer — fans, enclosures, heat sinksSolid and fluid temperatures, h from the flow→ with S-02 CFD
Thermal–electric (Joule)Busbars, contacts, conductors, heatersCurrent density, I²R losses, temperature
Radiation & solar loadOutdoor enclosures, high-temperature equipmentSurface temperatures incl. radiation exchangeSite data · emissivities stated
Thermal stressTemperature differences or mismatched expansionThermal strains and stresses, fatigue from cycling→ with S-01 Structural
Test correlationThermocouple or thermal-camera data availableMeasured vs. predicted, updated model→ with your test data
FIG. 2 — The heat path — thermal resistances in seriesSCHEMATIC
q = 20 W R_jc · 0.5 K/W ΔT 10 K R_cs · 0.3 K/W ΔT 6 K R_sa · 1.7 K/W ΔT 34 K T_j 90 °C T_c 80 °C T_s 74 °C T_a 40 °C T_j = T_a + q · (R_jc + R_cs + R_sa) = 40 + 20 · 2.5 = 90 °C illustrative values · the FE / CHT model replaces R_sa with the real heat path Every kelvin between the junction and the air is a resistance times the heat flow. The model finds which resistance dominates — the one worth spending money on. (Illustrative values.)
FIG. 3 — Transient heating — the time constant τSCHEMATIC
63.2 % at t = τ 95 % at 3τ steady state T_ss — compare with T_max τ 3τ 5τ 0 time t → temperature rise θ A body heated at constant power reaches 63 % of its final rise after one time constant and 95 % after three. Short overloads are safe only if they end well before that.

04 / PROCESS & TIMELINE

From problem statement to signed report.

Five steps, each with a clear hand-off. You always know what we need from you and what you get back.

  1. 012 day

    Scoping call

    FROM YOUProblem statement, drawings, limits
    FROM USNDA, list of questions and missing data
  2. 022 days

    Scope & fixed quote

    FROM YOUHeat losses, cooling data, operating points
    FROM USWritten scope, assumptions, acceptance criteria, price
  3. 037 days

    Model & solve

    FROM YOUCAD, materials, interface data
    FROM USInterim check-in: heat paths and first temperatures
  4. 042 days

    Verify & check

    FROM YOUNothing — internal step
    FROM USEnergy balance, hand check, sensitivity, second-engineer review
  5. 052 days

    Report & review

    FROM YOUYour comments on the draft
    FROM USSigned report, files, review meeting

05 / INPUTS

What we need from you.

REQUIRED
  • [✓]Geometry — STEP / IGES / Parasolid, or dimensioned drawings
  • [✓]Heat sources — losses per component at the operating points
  • [✓]Material data — conductivity, heat capacity, emissivity; interface materials
  • [✓]Cooling — fans, flow rates, heat sinks, ambient and solar conditions
  • [✓]Temperature limits and acceptance criteria
  • [✓]The decision the result feeds, and the deadline
HELPFUL IF AVAILABLE
  • [+]Measured temperatures or thermal-camera images
  • [+]Duty cycles and load profiles
  • [+]Fan curves and datasheets
  • [+]Previous calculations or test reports
  • [+]Comments from your customer or approver
INCOMPLETE DATA?Most projects start that way.We list what's missing in the scoping call. Anything we have to assume is recorded in the report's assumption register — never hidden in the model.

06 / THE REPORT

See the report before you buy it.

A signed, revision-controlled report of 60 pages on average. Every temperature is traced to an operating point, a heat load from a named datasheet and a boundary condition with its source.

  1. T1
    Assumption registerEvery assumption — above all contact resistances and h values — numbered and justified.
  2. T2
    Heat-load traceabilityEach heat source names its operating point and the datasheet it comes from.
  3. T3
    Verification evidenceEnergy balance, resistance-network hand check and mesh study — included, not just claimed.
  4. T4
    Reproducible modelSolver, version, material data, boundary conditions and correlations are stated.
  5. T5
    Plain-language conclusionOne page a manager can read: within limits or not, the margin, and what to change.

07 / APPLICATIONS

Typical equipment and structures.

Electrical cabinets & switchgearBusbars · breakers · temperature rise
Power electronicsInverters · converters · heat sinks
Transformers & reactorsHot spot · cooling · overload
Enclosures & housingsNatural convection · fans · solar load
Data-center equipmentRack inlet temperatures · airflow
Battery & e-drive componentsCell temperatures · cooling plates
StructuresThermal actions · expansion · fire
Medical & lab equipmentTouch temperature · internal hot spots

08 / STANDARDS

Checked to the clause your approver reads.

Temperature limits and verification methods come from the standard your equipment is designed or certified to — cited in the report.

STANDARDWHAT WE USE IT FOR
IEC 61439-1Low-voltage switchgear assemblies — temperature-rise verification
IEC 60076-2Power transformers — temperature rise
IEC 62368-1Equipment safety — touch-temperature limits
JEDEC JESD51Thermal characterisation of electronic packages (θ_JA, θ_JC)
EN 1991-1-5Thermal actions on structures
ASHRAE TC 9.9Thermal guidelines for data processing environments

09 / HOW TO ENGAGE

Three ways to work with us.

Prices are fixed per written scope. You pay for the answer to a defined question, not for open-ended hours.

E-01PROJECT

Fixed-scope project

BEST FOR
A defined part or structure with a clear question
PRICE
Fixed quote after scoping
Start with a problem statement
E-02RETAINER

Engineering retainer

BEST FOR
Design teams with recurring analysis needs
PRICE
Quoted per scope
Discuss a retainer
E-03REVIEW

Third-party review

BEST FOR
Checking an FEA or hand calculation done by someone else
PRICE
Fixed quote
Request a review

10 / FAQ

Asked before every project.

Something else? Ask it in the problem statement — the answer comes with the scope.

Which software do you use?

Tessera — the solver we build — runs the free calculators on this site today, each published with its reference cases. For project work the solver is chosen against the standard the result must satisfy, and named in the written scope. Every report states the solver, version, material data and how convection was modelled.

Do we need CFD, or is a thermal model enough?

If convection can be described by correlations — a wall, a fin, a known airflow — a thermal model is enough. If the airflow itself decides the result, we couple it with CFD (S-02).

Our component datasheet only gives losses at one point. Is that enough?

Often yes. We use the worst credible operating point and state it; if the answer is close to the limit, we ask for more data or run a sensitivity.

Can you use our thermocouple or thermal-camera data?

Yes — measured temperatures are used to calibrate contact resistances and h values, and the comparison is reported.

Can the temperatures feed a structural check?

Yes — the temperature field is mapped to the FE model for thermal stress. See S-01 Structural.

How is the price set?

Per written scope: number of components and operating points, and whether transient, CHT or thermal-stress analysis is needed.

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11 / PROBLEM STATEMENT

Send the heat load. Get a written scope back.

Tell us what heats up, how it is cooled and which temperature it must stay below. We reply with questions or a fixed scope.

  • [✓] NDA before data exchange
  • [✓] Response within [X] business day(s)
  • [✓] Scope, assumptions & acceptance criteria in writing